Performance analysis of single-walled carbon nanotube bundle interconnects for three-dimensional integration applications
Yang, Yintang, Ding, Ruixue, Zhu, Zhangming, Qian, LiboVolume:
8
Language:
english
Journal:
Micro & Nano Letters
DOI:
10.1049/mnl.2012.0856
Date:
January, 2013
File:
PDF, 196 KB
english, 2013