Controlled solder interdiffusion for high power...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1997 / 5 Vol. 20; Iss. 2

Controlled solder interdiffusion for high power semiconductor laser diode die bonding

Merritt, S.A., Heim, P.J.S., Si Hyung Cho,, Dagenais, M.
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Volume:
20
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.575565
Date:
May, 1997
File:
PDF, 505 KB
english, 1997
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