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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Nano-integrated adhesive for cryogenic packaging (4K) of harsh environment electronics
John, Ranjith Samuel E., Malshe, Ajay P., Dotsenko, Vladimir, Delmas, Jean, Webber, Robert, Gupta, DeepnarayanYear:
2010
Language:
english
DOI:
10.1109/ECTC.2010.5490661
File:
PDF, 871 KB
english, 2010