[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - A clamped through silicon via (TSV) interconnection for stacked chip bonding using metal cap on pad and metal column forming in via
Li-Cheng Shen,, Chien-Wei Chien,, Jin-Ye Jaung,, Yin-Po Hung,, Wei-Chung Lo,, Chao-Kai Hsu,, Yuan-Chang Lee,, Hsien-Chie Cheng,, Chia-Te Lin,Year:
2008
Language:
english
DOI:
10.1109/ECTC.2008.4550026
File:
PDF, 979 KB
english, 2008