![](/img/cover-not-exists.png)
Growth behaviors of intermetallic compound layers in Cu/Al joints brazed with Zn–22Al and Zn–22Al–0.05Ce filler metals
Feng, Ji, Xue, SongbaiVolume:
51
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2013.04.069
Date:
October, 2013
File:
PDF, 2.98 MB
english, 2013