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SPIE Proceedings [SPIE SPIE LASE - San Francisco, California, USA (Saturday 2 February 2013)] Laser-based Micro- and Nanopackaging and Assembly VII - Laser-assisted ultrathin bare die packaging: a route to a new class of microelectronic devices
Marinov, Val R., Swenson, Orven, Atanasov, Yuriy, Schneck, Nathan, Klotzbach, Udo, Lu, Yongfeng, Washio, KunihikoVolume:
8608
Year:
2013
Language:
english
DOI:
10.1117/12.2004344
File:
PDF, 2.82 MB
english, 2013