3-D Multilayer Copper Interconnects for High-Performance...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 06 Vol. 3; Iss. 6

3-D Multilayer Copper Interconnects for High-Performance Monolithic Devices and Passives

Ghannam, Ayad, Bourrier, David, Ourak, Lamine, Viallon, Christophe, Parra, Thierry
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2013.2258073
Date:
June, 2013
File:
PDF, 1.37 MB
english, 2013
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