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Generating Compact, Guaranteed Passive Reduced-Order Models of 3-D RLC Interconnects
Marques, N., Kamon, M., Silveira, L.M., White, J.K.Volume:
27
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/TADVP.2004.831867
Date:
November, 2004
File:
PDF, 651 KB
english, 2004