Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters
Hokka, Jussi, Mattila, Toni. T., Xu, Hongbo, Paulasto-Kröckel, MerviVolume:
42
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-013-2551-x
Date:
June, 2013
File:
PDF, 1.08 MB
english, 2013