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Full-wave electromagnetic and thermal modeling for the prediction of heat-dissipation-induced RF-MEMS switch failure
Wang, Zhongde, Jensen, Brian D, Chow, Linda L W, Volakis, John L, Saitou, Kazuhiro, Kurabayashi, KatsuoVolume:
16
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/16/1/021
Date:
January, 2006
File:
PDF, 589 KB
english, 2006