Peak-to-Peak Ground Noise on a Power Distribution TSV Pair...

IEEE Transactions on Components Packaging and Manufacturing Technology 2011 / 02 Vol. 1; Iss. 2

Peak-to-Peak Ground Noise on a Power Distribution TSV Pair as a Function of Rise Time in 3-D Stack of Dies Interconnected Through TSVs

Ahmad, Waqar, Zheng, Li-Rong, Chen, Qiang, Tenhunen, Hannu
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Volume:
1
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2010.2099732
Date:
February, 2011
File:
PDF, 1.33 MB
english, 2011
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