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Effect of [Al] and [In] molar ratio in solutions on the growth and microstructure of electrodeposition Cu(In,Al)Se2 films
Huang, Kuo-Chan, Liu, Chien-Lin, Hung, Pin-Kun, Houng, Mau-PhonVolume:
273
Language:
english
Journal:
Applied Surface Science
DOI:
10.1016/j.apsusc.2013.02.121
Date:
May, 2013
File:
PDF, 1.48 MB
english, 2013