![](/img/cover-not-exists.png)
Molecular Modeling and Multiscaling Issues for Electronic Material Applications || Semi Emprical Low Cycle Fatigue Crack Growth Analysis of Nanostructure Chip-To-Package Copper Interconnect Using Molecular Simulation
Iwamoto, Nancy, Yuen, Matthew M.F., Fan, HaiboVolume:
10.1007/97
Year:
2012
Language:
english
DOI:
10.1007/978-1-4614-1728-6_5
File:
PDF, 1.98 MB
english, 2012