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Simulation of the filling process in micro channels for polymeric materials
Yao, Donggang, Kim, ByungVolume:
12
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/12/5/314
Date:
September, 2002
File:
PDF, 215 KB
english, 2002