Crack propagation and fracture in silicon wafers under thermal stress
Danilewsky, Andreas, Wittge, Jochen, Kiefl, Konstantin, Allen, David, McNally, Patrick, Garagorri, Jorge, Elizalde, M. Reyes, Baumbach, Tilo, Tanner, Brian K.Volume:
46
Language:
english
Journal:
Journal of Applied Crystallography
DOI:
10.1107/S0021889813003695
Date:
August, 2013
File:
PDF, 502 KB
english, 2013