Examination of mechanical stresses in silicon substrates...

Semiconductor Science and Technology 2002 / 12 Vol. 17; Iss. 12

Examination of mechanical stresses in silicon substrates due to lead tin solder bumps via micro-Raman spectroscopy and finite element modelling

Kanatharana, J, P rez-Camacho, J J, Buckley, T, McNally, P J, Tuomi, T, Riikonen, J, Danilewsky, A N, O Hare, M, Lowney, D, Chen, W, Rantam ki, R, Knuuttila, L
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Volume:
17
Language:
english
Journal:
Semiconductor Science and Technology
DOI:
10.1088/0268-1242/17/12/308
Date:
December, 2002
File:
PDF, 453 KB
english, 2002
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