Modeling Thermal Stresses in 3-D IC Interwafer...

IEEE Transactions on Semiconductor Manufacturing 2006 / 11 Vol. 19; Iss. 4

Modeling Thermal Stresses in 3-D IC Interwafer Interconnects

Zhang, Jing, Bloomfield, Max O., Lu, Jian-qiang, Gutmann, Ronald J., Cale, Timothy S.
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Volume:
19
Language:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/TSM.2006.883587
Date:
November, 2006
File:
PDF, 2.22 MB
english, 2006
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