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Stress evolution during and after sputter deposition of Cu thin films onto Si (100) substrates under various sputtering pressures
Pletea, M., BruÌckner, W., Wendrock, H., Kaltofen, R.Volume:
97
Year:
2005
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.1858062
File:
PDF, 701 KB
english, 2005