Stress evolution during and after sputter deposition of Cu...

Stress evolution during and after sputter deposition of Cu thin films onto Si (100) substrates under various sputtering pressures

Pletea, M., Brückner, W., Wendrock, H., Kaltofen, R.
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Volume:
97
Year:
2005
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.1858062
File:
PDF, 701 KB
english, 2005
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