Mechanical Properties for...

IEEE Transactions on Components and Packaging Technologies 2005 / 12 Vol. 28; Iss. 4

Mechanical Properties for 95.5Sn–3.8Ag–0.7Cu Lead-Free Solder Alloy

Pang, J.H.L., Xiong, B.S.
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/TCAPT.2005.848587
Date:
December, 2005
File:
PDF, 1.59 MB
english, 2005
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