Ultralow-Capacitance Through-Silicon Vias With Annular...

IEEE Transactions on Electron Devices 2013 / 04 Vol. 60; Iss. 4

Ultralow-Capacitance Through-Silicon Vias With Annular Air-Gap Insulation Layers

Chen, Qianwen, Huang, Cui, Wu, Dong, Tan, Zhimin, Wang, Zheyao
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Volume:
60
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/TED.2013.2244895
Date:
April, 2013
File:
PDF, 545 KB
english, 2013
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