Development of 3-D Silicon Module With TSV for System in...

IEEE Transactions on Components and Packaging Technologies 2010 / 03 Vol. 33; Iss. 1

Development of 3-D Silicon Module With TSV for System in Packaging

Khan, N., Rao, V.S., Lim, S., Ho Soon We,, Lee, V., Xiaowu Zhang,, Liao, E.B., Nagarajan, R., Chai, T.C., Kripesh, V., Lau, J.H.
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Volume:
33
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/TCAPT.2009.2037608
Date:
March, 2010
File:
PDF, 1008 KB
english, 2010
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