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Shelf-Life Study of Ag/NiNiP-Plated Cu Leadframes Without Anti-Tarnish Coating
Li, Wu-HuVolume:
1
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2010.2103563
Date:
April, 2011
File:
PDF, 534 KB
english, 2011