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Modeling of silicon thermal expansion using strained phonon spectra
Zhang, Wei-Wei, Yu, Hong, Lei, Shuang-Ying, Huang, Qing-AnVolume:
22
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/22/8/085007
Date:
August, 2012
File:
PDF, 735 KB
english, 2012