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A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder Joints
Chen, J. K., Beraun, J. E., Tzou, D. Y.Volume:
123
Year:
2001
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1326438
File:
PDF, 113 KB
english, 2001