A Dual-Phase-Lag Diffusion Model for Predicting...

Journal of Electronic Packaging 2001 Vol. 123; Iss. 1

A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder Joints

Chen, J. K., Beraun, J. E., Tzou, D. Y.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
123
Year:
2001
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1326438
File:
PDF, 113 KB
english, 2001
Conversion to is in progress
Conversion to is failed