Methods for characterization of wafer-level encapsulation...

Journal of Micromechanics and Microengineering 2010 / 06 Vol. 20; Iss. 6

Methods for characterization of wafer-level encapsulation applied on silicon to LTCC anodic bonding

Khan, M F, Ghavanini, F A, Haasl, S, Löfgren, L, Persson, K, Rusu, C, Schjølberg-Henriksen, K, Enoksson, P
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Volume:
20
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/20/6/064020
Date:
June, 2010
File:
PDF, 2.02 MB
english, 2010
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