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Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles
El-Daly, A. A., Fawzy, A., Mansour, S. F., Younis, M. J.Volume:
24
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-013-1200-8
Date:
August, 2013
File:
PDF, 1.29 MB
english, 2013