[IEEE 2011 International Symposium on Advanced Packaging...

  • Main
  • [IEEE 2011 International Symposium on...

[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - Effect of different latent curing agents on the performance of isotropy conductive adhesives and its application in LED

Wang, Ling, Wang, Hongqin, Wan, Chao, Wang, Pengcheng, Li, Mingyu, Du, Bin, Deng, Meiling, He, Lijiao
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2011
Language:
english
DOI:
10.1109/ISAPM.2011.6105750
File:
PDF, 105 KB
english, 2011
Conversion to is in progress
Conversion to is failed