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[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - Effect of different latent curing agents on the performance of isotropy conductive adhesives and its application in LED
Wang, Ling, Wang, Hongqin, Wan, Chao, Wang, Pengcheng, Li, Mingyu, Du, Bin, Deng, Meiling, He, LijiaoYear:
2011
Language:
english
DOI:
10.1109/ISAPM.2011.6105750
File:
PDF, 105 KB
english, 2011