Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism
Dudek, R., Berek, H., Fritsch, T., Michel, B.Volume:
23
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.868845
Date:
January, 2000
File:
PDF, 645 KB
english, 2000