![](/img/cover-not-exists.png)
Open Circuit Repair Using Thermal Exchange Deposition of Copper
Gutfeld, R. J. Von, Vigliotti, D. R.Volume:
204
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-204-433
Date:
January, 1990
File:
PDF, 1004 KB
english, 1990