A wafer-level package of wideband microwave transmission system based on BCB/metal structure embedded in Si substrate
Wang, Tianxi, Tang, Jiajie, Luo, LeVolume:
19
Language:
english
Journal:
Microsystem Technologies
DOI:
10.1007/s00542-013-1765-4
Date:
December, 2013
File:
PDF, 612 KB
english, 2013