Enabling interconnect scaling with Spacer-Defined Double...

Microelectronic Engineering 2013 / 12 Vol. 112

Enabling interconnect scaling with Spacer-Defined Double Patterning (SDDP)

Siew, Yong Kong, Stucchi, Michele, Versluijs, Janko, Roussel, Philippe, Kunnen, Eddy, Pantouvaki, Marianna, Beyer, Gerald P., Tokei, Zsolt
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Volume:
112
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2013.02.038
Date:
December, 2013
File:
PDF, 1.22 MB
english, 2013
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