Thermal performance of collector-up HBTs for small...

IEEE Transactions on Components and Packaging Technologies 2005 / 03 Vol. 28; Iss. 1

Thermal performance of collector-up HBTs for small high-power amplifiers with a novel thermal via structure underneath the HBT fingers

Osone, Y., Mochizuki, K., Tanaka, K.
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/TCAPT.2005.843435
Date:
March, 2005
File:
PDF, 415 KB
english, 2005
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