Electrodeposition of bismuth, lead, thallium, and copper at...

Electrodeposition of bismuth, lead, thallium, and copper at silver(111) from aqueous solutions. Studies by Auger spectroscopy and low-energy electron diffraction

Laguren-Davidson, Laarni, Lu, Frank, Salaita, Ghaleb N., Hubbard, Arthur T.
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Volume:
4
Language:
english
Journal:
Langmuir
DOI:
10.1021/la00079a041
Date:
January, 1988
File:
PDF, 4.81 MB
english, 1988
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