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[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Non-destructive testing of a high dense small dimension through silicon via (TSV) array structures by using 3D X-ray computed tomography method (CT scan)
Sekhar, V. N., Sam Neo,, Li Hong Yu,, Trigg, Alastair David, Kuo, Cheng ChengYear:
2010
Language:
english
DOI:
10.1109/EPTC.2010.5702683
File:
PDF, 1.75 MB
english, 2010