Twisted Differential Line Structure on High-Speed Printed Circuit Boards to Reduce Crosstalk and Radiated Emission
Kam, D.G., Lee, H., Kim, J.Volume:
27
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/TADVP.2004.831838
Date:
November, 2004
File:
PDF, 1.41 MB
english, 2004