![](/img/cover-not-exists.png)
[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - 3D-TSV vertical interconnection method using Cu/SnAg double bumps and B-stage non-conductive adhesives (NCAs)
Choi, Yongwon, Shin, Jiwon, Paik, Kyung-WookYear:
2012
Language:
english
DOI:
10.1109/ECTC.2012.6248969
File:
PDF, 637 KB
english, 2012