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[IEEE 2013 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) - Hsinchu (2013.4.22-2013.4.24)] 2013 International Symposium onVLSI Design, Automation, and Test (VLSI-DAT) - Enabling inter-die co-optimization in 3-D IC with TSVs
Chang-Tzu Lin,, Tsu-Wei Tseng,, Yung-Fa Chou,, Chia-Hsin Lee,, Ding-Ming Kwai,Year:
2013
Language:
english
DOI:
10.1109/VLDI-DAT.2013.6533885
File:
PDF, 777 KB
english, 2013