Ligand-free C–N bond formation in aqueous medium using a reusable Cu–Mn bimetallic catalyst
Sawant, Sanghapal D., Srinivas, Mahesuni, Aravinda Kumar, K.A., Lakshma Reddy, G., Singh, Parvinder Pal, Singh, Baldev, Sharma, Amit Kumar, Sharma, P.R., Vishwakarma, Ram A.Volume:
54
Language:
english
Journal:
Tetrahedron Letters
DOI:
10.1016/j.tetlet.2013.07.095
Date:
September, 2013
File:
PDF, 1.08 MB
english, 2013