Effects of Electrolyte Formulas on Electrochemical Polish...

Key Engineering Materials 2010 / 9 Vol. 447-448

Effects of Electrolyte Formulas on Electrochemical Polish Planarization of Pure Copper

Huang, J.C., Weng, Yung Jin, Weng, Yung Chun, Chan, Y.F., Liu, Hsu Kang, Fang, H.S.
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Volume:
447-448
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.447-448.159
Date:
September, 2010
File:
PDF, 784 KB
english, 2010
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