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[IEEE 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2009.10.19-2009.10.21)] 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems - Active circuit to through silicon via (TSV) noise coupling
Cho, Jonghyun, Shim, Jongjoo, Song, Eakhwan, Pak, Jun So, Lee, Junho, Lee, Hyungdong, Park, Kunwoo, Kim, JounghoYear:
2009
Language:
english
DOI:
10.1109/EPEPS.2009.5338469
File:
PDF, 550 KB
english, 2009