![](/img/cover-not-exists.png)
[IEEE 2010 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2010.12.6-2010.12.8)] 2010 International Electron Devices Meeting - Compact modeling and analysis of coupling noise induced by through-Si-vias in 3-D ICs
Xu, Chuan, Suaya, Roberto, Banerjee, KaustavYear:
2010
Language:
english
DOI:
10.1109/IEDM.2010.5703319
File:
PDF, 380 KB
english, 2010