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[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - An atomistic scale study on solidification in ultrafine interconnects
Wu, Zhiyong, Huang, Zhiheng, Conway, Paul, Qingfeng Zeng,Year:
2012
Language:
english
DOI:
10.1109/EMAP.2012.6507903
File:
PDF, 1.57 MB
english, 2012