Indentation creep of lead-free Sn–3.5Ag solder alloy:...

Materials Science and Engineering: A 2013 / 3 Vol. 565

Indentation creep of lead-free Sn–3.5Ag solder alloy: Effects of cooling rate and Zn/Sb addition

Mahmudi, R., Pourmajidian, M., Geranmayeh, A.R., Gorgannejad, S., Hashemizadeh, S.
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Volume:
565
Language:
english
Journal:
Materials Science and Engineering: A
DOI:
10.1016/j.msea.2012.12.048
Date:
March, 2013
File:
PDF, 1.25 MB
english, 2013
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