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[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - The wetting interaction between electroless NiP deposit/Cu substrate and SnAg solder
Hsieh, Peishan, Lin, Kwang-LungYear:
2011
Language:
english
DOI:
10.1109/IMPACT.2011.6117224
File:
PDF, 732 KB
english, 2011