Effect of Process Parameters on Material Removal Rate in Chemical Mechanical Polishing of 6H-SiC(0001)
An, Joon Ho, Lee, Gi Sub, Lee, Won Jae, Shin, Byoung Chul, Seo, Jung Doo, Ku, Kap Ryeol, Seo, Heon Decok, Jeong, Hae DoVolume:
600-603
Year:
2009
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.600-603.831
File:
PDF, 605 KB
english, 2009