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Fabrication of a large-scale Ni stamp using a multi-level SU-8 photoresist mold for advanced printed circuit board manufacturing
Lee, H-S, Yang, H-H, Ra, S, Yoon, J-BVolume:
21
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/21/6/065026
Date:
June, 2011
File:
PDF, 2.30 MB
english, 2011