Phase transformation and grain orientation of Cu–Sn...

Journal of Materials Science: Materials in Electronics 2013 / 10 Vol. 24; Iss. 10

Phase transformation and grain orientation of Cu–Sn intermetallic compounds during low temperature bonding process

Chunjin Hang, Yanhong Tian, Rui Zhang…
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Volume:
24
Language:
english
DOI:
10.1007/s10854-013-1337-5
Date:
October, 2013
File:
PDF, 1.53 MB
english, 2013
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