Microstructural stability of Ag sinter joining in thermal...

Journal of Materials Science: Materials in Electronics 2013 / 04 Vol. 24; Iss. 4

Microstructural stability of Ag sinter joining in thermal cycling

Soichi Sakamoto, Tohru Sugahara…
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Volume:
24
Language:
english
DOI:
10.1007/s10854-012-0929-9
Date:
April, 2013
File:
PDF, 1018 KB
english, 2013
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