Interfacial reaction of Sn–2.0Ag–2.5Zn solder on Cu and...

Journal of Materials Science: Materials in Electronics 2013 / 03 Vol. 24; Iss. 3

Interfacial reaction of Sn–2.0Ag–2.5Zn solder on Cu and Ni–W substrates

Yucheng Liu, Anmin Hu, Tingbi Luo, Ming Li
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Volume:
24
Language:
english
DOI:
10.1007/s10854-012-0874-7
Date:
March, 2013
File:
PDF, 867 KB
english, 2013
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