The development of automated solder bump inspection using...

The development of automated solder bump inspection using machine vision techniques

Wen-Yen Wu, Ching-Wen Hung, Wen-Bin Yu
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Volume:
69
Language:
english
DOI:
10.1007/s00170-013-4994-x
Date:
October, 2013
File:
PDF, 898 KB
english, 2013
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